CWM630_Shanghai Yuge

Product category: 4G Module

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LPM2100 qc LPM2100 bm LPM2100 bt LPM2100 bg LPM2100 mg LPM2100 qg; 3G Module

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3G Module

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CWM630

CWM630 is a HSDPA module with a stamp hole patch package. It uses Qualcomm's latest WCDMA single-chip platform QSC6270 supports embedded operating systems such as WinCE/Linux and has functions such as voice SMS and high-speed data services.

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Related products

Manual Download

CWM630 HSDPA Stamp Hole Module Hardware User Guide

YUGA_CWM630_AT

Driver Download

3G Windows driver

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